A-Tech 4GB DDR3 1600 ECC SODIMM CL11 1.5V 204-Pin 1Rx8
- 4 GB
- 204-Pin DDR3 SO-DIMM
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8GB DDR3 1333 ECC SODIMM adds 1.5V error-correcting memory to compatible laptops, workstations and NAS units
Capacity 8GB
Speed DDR3 1333 (PC3 10600)
CAS Latency CL9
This 8 GB DDR3 module runs at 1333 MHz with CL9 latency and ECC error correction. It uses the 204-pin SO-DIMM form factor and operates at the standard 1.5 V. The unbuffered, dual-rank design suits compatible microservers, mobile workstations and NAS appliances.
Builders whose platforms lack ECC support in the chipset or BIOS cannot use the error-correction feature and should select non-ECC memory instead. Laptops or small-form-factor devices that only accept single-rank modules may not recognise this dual-rank stick. Older boards limited to lower densities per slot will also be incompatible.
The single specification that decides fit is the combination of ECC unbuffered operation and DDR3 1333 speed. If the system documentation calls for registered ECC, non-ECC, or a different DDR generation, this module will not work.
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| Product | |
|---|---|
| Brand name | A-Tech |
| Product line | A-Tech DDR3 ECC SODIMM |
| Model name | A-Tech 8 GB 2Rx8 PC3-10600 ECC SODIMM |
| Part number | NE-SS-0562 |
| Total capacity | 8 GB |
| Product type | 204-Pin DDR3 SO-DIMM |
| Performance | |
| Rated speed | DDR3 1333 (PC3 10600) |
| Memory | |
| CAS latency | CL9 |
| ECC support | Yes |
| Buffer type | Unbuffered |
| Heat spreader | No |
| Power | |
| Rated voltage | 1.5 V |
| Compatibility | |
| Recommended for | AMD & Intel Compatible |
| More details | |
| Variant | ECC SODIMM |
Other versions of this model
The module has no moving parts and no heat spreader; once seated in a 204-pin DDR3 slot at 1.5 V it requires no scheduled replacement.
The CL9 latency at PC3-10600 speed is the fixed timing ceiling; sustained workloads cannot exceed the JEDEC 1333 MHz data rate.
With no heat spreader and standard 1.50 V DDR3 voltage, the stick adds minimal thermal load and produces no audible noise.
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