AMD EPYC 7302 100-100000043WOF 16-core 3.0 GHz server processor
- EPYC 7302
- 16-Core
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32-core server processor with 2.9 GHz base and 3.4 GHz boost, 128 MB L3 cache, 8-channel DDR4 3200 support, 128 PCIe 4.0 lanes and 225 W TDP in Socket SP3
Model 7542
The AMD EPYC 7542 is a 32-core, 64-thread server CPU built for Socket SP3 platforms. It runs at a 2.9 GHz base frequency and reaches a 3.4 GHz maximum boost clock. The processor provides 128 MB of L3 cache and 16 MB of L2 cache alongside an integrated DDR4-3200 memory controller with eight channels.
This processor fits 1P and 2P configurations that need 128 lanes of PCIe 4.0 connectivity for dense I/O. Buyers who require an included cooler should look elsewhere because the package contains the processor only. Systems limited to lower TDP envelopes or fewer memory channels will not match the 225 W design point or the eight-channel architecture.
The 225 W thermal design power is the single figure that determines whether a chassis, power supply and cooler can support this part. Without a cooling solution in the box, the builder must provision adequate heat dissipation for sustained 2.9 GHz operation across all 32 cores.
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| Product | |
|---|---|
| Brand name | AMD |
| Product line | AMD EPYC 7002 |
| Model name | 100-100000075WOF |
| Product name | EPYC 7542 |
| Performance | |
| Working frequency | 2.9 GHz |
| Processor | |
| CPU cores | 32-Core |
| CPU socket | Socket SP3 |
| Maximum turbo clock | 3.4 GHz |
| TDP rating | 225 W |
| CPU threads | 64 |
| Level 3 cache | 128 MB |
| 64-bit capable | Yes |
| Maximum PCIe lanes | 128 |
| Memory | |
| Supported memory speed | DDR4 3200 |
| Channel configuration | 8 Channel |
| Ports & slots | |
| PCIe generation | 4.0 |
| Size & build | |
| Shipping weight | 0.91 kg |
| Package size | 305 × 229 × 102 mm |
| In the box | |
| Included cooler | Not included - Processor Only |
Other versions of this model
The processor ships without a cooling device, so a compatible SP3 cooler rated for 225 W must be sourced separately; no user-serviceable parts exist on the CPU itself.
With a 225 W TDP and 8-channel DDR4-3200 memory, the thermal envelope typically becomes the binding constraint before memory bandwidth saturates.
Sustained 225 W output demands robust airflow; expect significant case heat and fan noise proportional to the cooler chosen for the SP3 socket.
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