ARCTIC COOLING ACTCP00002B MX-4 4 g thermal paste
- 4.0g
- 8.5 W/mK
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Carbon-based thermal compound rated at 8.5 W/mK conductivity for CPU and GPU heat transfer
Weight 2 g
ARCTIC MX-4 2019 Edition is a carbon-based thermal compound supplied in a 2.0 g syringe. It targets PC builders and upgraders who need reliable heat transfer for CPUs, GPUs and other chip packages. The paste is non-electrically conductive and non-capacitive, so accidental spread onto surrounding circuitry will not cause shorts. Its non-curing formula remains stable for at least eight years without drying out.
The material delivers a thermal conductivity of 8.5 W/mK and a viscosity of 870 poise at a density of 2.5 g/cm³. These figures set the practical ceiling for heat flow between a die and a cooler; the paste cannot overcome a cooler's own thermal resistance or a case's airflow limits. Because it contains no metal particles, it avoids the galvanic corrosion and electrical risk that liquid-metal compounds introduce. The non-bleeding characteristic means the compound stays in place under thermal cycling.
Before ordering, verify that your cooler's mounting mechanism provides even pressure across the die so the 2.0 g volume can form a thin, uniform layer. Confirm that both the die and cold-plate are clean, flat and free of old compound residue; any gaps or contamination will increase thermal resistance beyond what the 8.5 W/mK rating can compensate for. The syringe volume is sized for several typical desktop applications but may be insufficient for large server dies or multiple GPU repastes.
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| Product | |
|---|---|
| Brand name | ARCTIC COOLING |
| Product line | Arctic MX-4 2019 Edition |
| Model name | AC-MX4 |
| Performance | |
| Thermal conductivity | 8.5 W/mK |
| Size & build | |
| Net content | 2.0g |
| Shipping weight | 0.01 kg |
| Package size | 149 × 25 × 11 mm |
Other versions of this model
The 2.0 g syringe provides multiple applications for standard CPU sockets, so one tube covers a single installation with plenty left over.
The 8.5 W/mK rating indicates high heat-transfer capability, helping lower CPU temperatures under load when paired with a competent cooler.
The compound is non-capacitive and non-electrically conductive, eliminating short-circuit risk, and it does not cure, maintaining performance for at least 8 years.
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