ARCTIC COOLING Arctic Silver Alumina Thermal Paste 1.75g
Ceramic-based thermal compound in a 1.75 g tube for CPU heat-sink applications
- Ceramic-based compound eliminates electrical conductivity risk
- 75 g tube covers multiple CPU applications
- Polysynthetic formula ensures stable thermal transfer
- Non-metallic composition prevents short circuits on components
Arctic Silver Alumina 1.75 g tube
Arctic Silver Alumina is a polysynthetic ceramic thermal compound supplied in a 1.75 g tube. It is intended for CPU heat-sink interfaces in desktop or workstation builds. The non-conductive formula eliminates the risk of electrical shorts if excess paste spreads onto surrounding components. System builders seeking a reliable, electrically safe interface material will find it suitable.
Ceramic filler enables safe application
The ceramic filler makes the grease electrically non-conductive, so accidental contact with pins or traces will not cause shorts. This property simplifies application for less experienced builders who may apply more paste than necessary. The compound contains no metal particles, avoiding the risk of galvanic corrosion between dissimilar cooler and heat-spreader surfaces. Users requiring extremely high thermal conductivity for extreme overclocking may prefer metal-based alternatives.
How it compares
Measured against everything we stock in Thermal Paste, at today’s prices. Recalculated every night.
- Price $39.99
- Pricier than about 90% of the 498 comparable items (median $12.99).
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Specifications
| Product | |
|---|---|
| Brand name | ARCTIC |
Questions about this item
Will the polysynthetic ceramic compound dry out and need re-application over time?
The ceramic-based formula is designed for long-term stability and does not dry out like standard silicone greases, so re-application is rarely needed unless the cooler is removed.
What thermal limit appears first when running a CPU at full load continuously with this paste?
The compound handles typical desktop CPU temperatures well; the practical limit is usually the cooler's own heat-dissipation capacity rather than the thermal interface itself.
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