ASUS X870 MAX GAMING WIFI7 AMD Motherboard & Ryzen 9 9900X3D CPU Combo
- AM5
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A motherboard and CPU bundle pairing an AMD X870 board with 16+2+1 80A power stages, four M.2 slots, DDR5 support up to 256GB, WiFi7.
Motherboard TUF GAMING X870-PRO WIFI7 W NEO
CPU + R7 9800X3D
This motherboard and CPU bundle pairs the ASUS TUF GAMING X870-PRO WIFI7 W NEO with the AMD Ryzen 7 9800X3D processor. The board uses the AMD X870 chipset and AM5 socket, supporting Ryzen 9000, 8000 and 7000 series chips. Four DDR5 slots accept up to 256GB in dual-channel mode. The CPU delivers eight cores and sixteen threads based on the Zen 5 architecture with second-generation 3D V-Cache technology for reduced latency in games.
The motherboard employs a 16+2+1 phase design using 80A power stages on an eight-layer PCB with dual 8+8 pin ProCool connectors. AI Cooling II manages fan curves automatically based on system temperatures. The Realtek ALC1220P codec provides 7.1 channel audio. Connectivity includes WiFi7, 5Gb Ethernet, USB4 at 40Gbps and a 20Gbps USB-C port with 30W power delivery, all operating within standard thermal limits during typical desktop and gaming workloads.
Under continuous heavy loads the robust VRM and eight-layer PCB maintain stable power delivery to the CPU. PCIe 5.0 x16 and two PCIe 5.0 M.2 slots alongside two PCIe 4.0 M.2 slots provide high-bandwidth pathways for graphics and storage without bottlenecking. Asynchronous clock support and AI Overclocking assist with long-term frequency stability. The 64MB BIOS and Q-Release mechanisms simplify firmware updates and hardware swaps during extended use.
Measured against everything we stock in Motherboards for AMD CPUs, at today’s prices. Recalculated every night.
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| Product | |
|---|---|
| Brand name | ASUS |
| Model name | TUF GAMING X870-PRO WIFI7 W NEO+R7 9800 × 3D |
| Processor | |
| Chipset | AMD X870 |
| Memory | |
| Memory slot count | 4 × 288pin (DDR5) |
| Max supported RAM | 256 GB |
| Memory channels | Dual Channel |
| Memory profiles | AMD EXPO / Intel XMP / ASUS AEMP |
| ECC support | Yes |
| Buffering | Un-buffered |
| Storage | |
| SATA ports | 2 x SATA 6Gb/s |
| M.2 slots | 4 x M.2 (Support PCIe 5.0 x4 & PCIe 4.0 x4) |
| SATA and RAID support | 0/1/5/10 |
| Graphics | |
| Onboard video chip | Depends on AMD Ryzen Series Processor with Integrated Graphics |
| Audio & video | |
| Audio chip | Realtek ALC1220P |
| Sound channels | 7.1 Channels |
| Connectivity | |
| Ethernet controller | Realtek 5Gb |
| Maximum network speed | 5 Gbit/s |
| Wi-Fi standard | Wi-Fi 802.11 be |
| Bluetooth support | Yes |
| Ports & slots | |
| PCIe 5.0 x16 slots | 1 x PCI Express 5.0 x16 |
| PCIe 4.0 x16 slots | 2 x PCI Express 4.0 x16 |
| PCIe x16 slots | 2 x PCI Express x16 |
| PCIe x4 slots | 1 x PCI Express x4 |
| Rear panel ports | 2 x USB4 (40 Gbit/s) Type-C, 3 x USB 10 Gbit/s Type-A, 4 x USB 5 Gbit/s Type-A, 1 x USB 2.0 Type-A, 1 x HDMI, 1 x Wi-Fi module, 1 x Realtek 5Gb Ethernet port, 3 x Audio jacks, 1 x BIOS FlashBack button, 1 x Clear CMOS button |
| Serial ports | 1 |
| Video connectors | HDMI + 2 x USB Type-C |
| HDMI ports | 1 x HDMI port |
| Ethernet port | 1 x RJ45 |
| USB 3.1 ports | 3 x USB 3.1 |
| USB 3.0 ports | 6 x USB 3.0 |
| USB 2.0 ports | 1 x USB 2.0 |
| USB-C ports | 2 x USB Type-C port, with USB4 (40 Gbit/s) support |
| S/PDIF output | Yes |
| Audio jacks | 3 Ports |
| Onboard USB headers | 1 x USB Type-C header, with USB 3.2 Gen 2 × 2 + 1 x USB 3.2 Gen 1 header + 3 x USB 2.0 headers |
| Power | |
| Power connectors | 24 Pin |
| Size & build | |
| Form factor | ATX |
| Width and length | 12 in × 9.6 in |
| Compatibility | |
| Windows 11 support | Supported |
| More details | |
| South bridge | AMD X870 |
| Lighting | RGB |
Other versions of this model
Lift the retention lever, align the gold triangle on the CPU with the socket marker, lower the chip without pressure, then lock the lever; the step many miss is removing the plastic protective cover from the motherboard socket before seating the processor.
The 64 MB BIOS chip is surface-mounted and not user-replaceable; future updates are applied through the BIOS FlashBack button using a USB stick, so no physical chip swap is required.
The 80 A per stage rating sets the thermal ceiling; under continuous all-core work the VRM temperature rises first, so adequate case airflow and the included heatsinks become the practical limiting factor.
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