AVGPC 2U 24-Bay 2x Xeon 4310 128GB DDR4 1TB NVME 2x 8TB SSD
- 128 GB
- 1 TB
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Dual-socket blade server with two Xeon Gold 6134 processors at 3.2 GHz, 256 GB DDR4 memory and two 900 GB SAS drives
The Dell PowerEdge M640 is a half-height blade that installs two Intel Xeon Gold 6134 processors running at 3.2 GHz. It ships with 256 GB of DDR4 ECC registered memory and two 900 GB SAS 10 K drives behind a PERC H330 RAID controller. Remote management is handled by iDRAC9 Enterprise and a dual-port 10 Gb Ethernet adapter is fitted.
This blade fits organisations that need high core counts in a compact chassis and can expand memory to 1 TB across the available DIMM slots. It is not for buyers who want more storage bays than the two 2.5" slots provide, or who require GPU acceleration because only integrated graphics are present.
The installed 2.5" SAS hard drives deliver 1.8 TB of raw capacity and set the performance baseline for the PERC H330 controller. Any workload that needs faster or larger local storage must use external arrays or a different platform.
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| Product | |
|---|---|
| Brand name | DELL |
| Product line | PowerEdge |
| Model name | Blade |
| Product type | Blade |
| Processor | |
| Processor | Intel Xeon |
| Processor speed | 3.2 GHz |
| Installed CPUs | 2 |
| Max supported CPUs | 2 |
| Memory | |
| Installed RAM | 256 GB |
| Type of memory | DDR4 SDRAM |
| Maximum RAM capacity | 1 TB |
| Storage | |
| Installed storage | 1.8,00 |
| Disk controller | Dell PERC H330 SAS Storage Controller |
| Drive interface | SAS |
| Graphics | |
| Graphics chip | Integrated Graphics |
| Size & build | |
| Product dimensions | 22 × 22x 10 in |
| More details | |
| Management controller | iDRAC9 Enterprise |
Align each processor with the socket notches and lower the retention lever straight down; forcing a misaligned CPU bends pins and prevents the blade from posting.
Monitor SMART attributes via iDRAC9; replace any drive that shows reallocated sectors, and rebuild the RAID array promptly to avoid a second failure.
The blade's compact chassis reaches its inlet-temperature threshold before the CPU cores hit their maximum junction temperature, so adequate enclosure airflow is the limiting factor.
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