AVGPC 2U 24-Bay 2x Xeon 4310 128GB DDR4 1TB NVME 2x 8TB SSD
- 128 GB
- 1 TB
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A 24-bay 2.5-inch rack server with dual Xeon E5-2643 v3 3.4GHz CPUs and 768GB DDR4 memory
The Dell PowerEdge R730xd is a 2U rack server fitted with two Intel Xeon E5-2643 v3 processors running at 3.4GHz and 768GB of DDR4 ECC registered memory. It provides 24 small-form-factor drive bays for 2.5-inch SATA or SAS drives managed by a PERC H730 RAID controller. Remote administration is handled through iDRAC8 with an Enterprise licence. The chassis measures 36 by 24 by 10 inches and weighs 40 units.
This configuration suits teams that need maximum internal drive density in a 2U footprint and can use the installed 768GB memory capacity, which already matches the system maximum. Organisations requiring GPU compute, higher single-thread frequency, or a smaller chassis should evaluate other platforms. Buyers who need drives included must add them separately.
The defining specification is the 24-bay 2.5-inch chassis paired with the PERC H730 SAS controller, which determines how many drives you can attach and which RAID levels are available. The system ships without drives, so the controller and backplane choice directly dictates the storage architecture you can build.
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| Product | |
|---|---|
| Brand name | DELL |
| Product line | PowerEdge |
| Model name | Rack Mount |
| Product type | Rack |
| Processor | |
| Processor | Intel Xeon |
| Processor speed | 3.4 GHz |
| Installed CPUs | 2 |
| Max supported CPUs | 2 |
| Memory | |
| Installed RAM | 768 GB |
| Type of memory | DDR4 |
| Maximum RAM capacity | 768 GB |
| Storage | |
| Installed storage | 5.76,00 |
| Disk controller | Dell PERC H730 SAS Controller |
| Drive interface | SATA |
| Graphics | |
| Graphics chip | Integrated Graphics |
| Size & build | |
| Product dimensions | 36 × 24 × 10 in |
| More details | |
| Management controller | iDRAC8 - Enterprise License |
The 36 in depth needs a cabinet at least that deep with clearance for cables and airflow at the rear.
Both sockets are populated; the common mistake is forgetting to apply thermal paste and torque the heatsinks to specification before closing the lid.
Replace modules only if ECC errors appear or capacity must exceed the 768 GB maximum supported by this chassis.
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