Easycargo 30-B-Si-3W Thermal Pad Kit 30pcs Multiple Sizes 3 W/mk

30-piece thermal pad kit with 3 W/mk conductivity

The Easycargo 30-B-Si-3W kit supplies thirty silicone thermal pads in six different thicknesses and footprints. Each pad is rated at 3 W/mk thermal conductivity and is designed to fill gaps between IC chips, NVMe M.2 SSDs, motherboard components and heatsinks. The material is non-conductive, anti-static and remains stable from -40 to 200 degrees Celsius without melting or emitting odour.

Replaces thermal paste for gap-filling applications

Unlike traditional grease or tape, these soft, slightly sticky pads conform to uneven surfaces and can be trimmed to any shape with scissors. The jump is worthwhile when a component sits above the heatsink base or when multiple chip heights must be bridged in a single assembly. Builders who need a single uniform thickness for every contact will not find that here.

Consistent performance under continuous heat soak

The silicone compound maintains its conductivity and physical integrity during prolonged loads, resisting pump-out and dry-out that affect paste over time. Pads compress to fill microscopic voids and provide electrical isolation while transferring heat from VRAM, voltage regulators or SSD controllers. The assortment includes 0.5 mm, 1 mm and 2 mm thicknesses so sustained contact pressure is preserved across varied stack heights.