GELID SOLUTIONS GP-Extreme 12W Thermal Pad 80x40x3.0mm

Purpose-built thermal pad

The GP-Extreme is a 12 W/mK thermal pad cut to 80 × 40 mm and 3.0 mm thick. It targets builders and technicians who need a soft, non-conductive interface for uneven PCB surfaces on graphics cards, laptops, consoles and dense SMD assemblies. The material is non-corrosive, non-hardening and non-toxic.

Capacity and headroom

At 12 W/mK the pad moves heat efficiently across typical MOSFET, memory IC and micro-controller heights, filling gaps up to its 3.0 mm thickness without excessive pressure. It runs out of headroom when the stack height exceeds that thickness or when a higher-conductivity paste is required for direct die contact.

Thickness selector

This specific SKU is the 3.0 mm variant; the same series also exists in 0.5, 1.0, 1.5 and 2.0 mm. Choose the thickness that matches the exact gap between component and heatsink — using a pad that is too thick or too thin will degrade thermal transfer.