GELID SOLUTIONS GP-Extreme Thermal Pad 120 x 120 x 1.0 mm

GP-Extreme Thermal Pad 120 x 120 x 1.0 mm

This thermal pad provides a high-conductivity interface for transferring heat from components to a heatsink. It is designed for PCBs with varying heights and uneven surfaces such as memory ICs, MOSFETs, and micro-controllers. The soft material conforms to gaps effectively. It suits builders addressing hotspots on graphics cards, motherboards, or other dense assemblies.

Thermals noise and power draw

As a passive thermal interface material, the pad operates without any power draw, fan noise, or moving parts. Its thermal conductivity rating is 12 W/m·K, enabling efficient heat transfer across the 1.0 mm thickness. The pad remains electrically non-conductive during use. Performance depends on proper mounting pressure and surface flatness.

Upgrade path and fit

This pad replaces standard thermal pads or gap fillers where higher conductivity is required. The jump is worth it when stock pads cannot bridge uneven component heights or when temperatures on memory and VRM sections remain high. It is not for users needing a reusable solution, as the material deforms permanently on first compression. Buyers requiring thicknesses other than 1.0 mm must select a different variant.