GELID SOLUTIONS GP-Ultimate 15W/mK Thermal Pad 120x20x2.0mm

High-conductivity thermal pad 15 W/mK

The GP-Ultimate is a 120×20 mm thermal interface pad rated at 15 W/mK thermal conductivity. It is designed to transfer heat from DRAM ICs, VRM circuits, power MOSFETs and similar SMD components to attached heatsinks. The pad is non-electrically conductive, non-corrosive, non-curing and non-toxic. It suits builders who need a high-performance gap filler for memory modules, graphics cards or compact devices.

Verify thickness and surface dimensions first

Confirm that a 2.0 mm thickness matches the gap between your component and heatsink before ordering. The pad measures 120 mm by 20 mm, so ensure the target surface fits within that area or plan to trim it. Operating range spans -60 °C to 220 °C, so check that your application stays within those limits. No adhesive backing is mentioned, so mechanical pressure from the heatsink mount will be required.

Suits dense PCB cooling, not large IHS spreads

Ideal for VRM arrays, memory ICs, M.2 SSDs and other tightly packed SMD components where a thin, compliant pad conforms to uneven heights. Builders needing to cover a large integrated heat spreader or a CPU die should look at larger-format pads or pastes instead. Users who require a thickness other than 2.0 mm must select a different variant from the 0.5, 1.0, 1.5 or 3.0 mm options.