GELID SOLUTIONS GP-Ultimate Thermal Pad 120x120x1.5mm 15W/mK

Thermal Pad for Uneven Components

The GP-Ultimate is a 120×120 mm thermal pad rated at 15 W/mK conductivity. It bridges gaps on PCBs where surface heights vary, such as memory ICs, VRM circuits and M.2 SSDs. The pad is non-electrically conductive, non-corrosive and non-toxic. It operates reliably from -60 °C to 220 °C without hardening.

Builders Needing Gap-Fill on Dense Boards

This pad suits anyone fitting heatsinks to DRAM, MOSFETs or tightly packed SMDs where paste cannot maintain contact. The 1.5 mm thickness handles moderate height differences across a 120 mm square. Buyers who need thinner layers of 0.5 or 1.0 mm, or thicker 2.0 and 3.0 mm options, should choose a different grade. It is not suited for perfectly flat CPU dies where thin paste performs better.

15 W/mK Across a Full 120 mm Sheet

The 15 W/mK rating moves heat efficiently from VRMs, memory modules and SSD controllers to attached heatsinks. A single sheet covers large VRM arrays or multiple RAM sticks without cutting. The 1.5 mm depth compresses to fill uneven stacks but will not bridge very large gaps beyond its thickness. For extreme step heights a thicker pad is required.