MSI 939-S336-002 1U barebone server AM5 B650 4 DDR5 2×10G 2×2.5" 450W redundant
- Single AMD Ryzen 70…
- 1U
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A 2U rackmount barebone server holding twelve 3.5" or 2.5" Gen4 NVMe/SATA/SAS hot-swap bays plus two rear 2.5" bays, supporting dual 4th/5th Gen Xeon Scalable or Xeon Max CPUs
The GIGABYTE R283-S90-AAE3 is a 2U rackmount server barebone designed for general-purpose workloads. It arrives without CPUs, memory or storage so integrators can configure the platform to exact requirements. Dual LGA 4677 sockets support two processors with up to 350 W TDP each. The Intel C741 chipset provides 8-channel DDR5 across 32 DIMM slots.
This platform fits organisations deploying dual 4th or 5th Generation Intel Xeon Scalable or Xeon CPU Max Series processors with high memory counts and local flash storage. It does not suit single-socket deployments, towers or edge sites that need integrated graphics beyond the Aspeed AST2600 management controller. Buyers who want more than 12 front drive bays or more than five full-height PCIe Gen5 x16 slots should evaluate larger form factors.
The chassis provides 12 x 3.5"/2.5" hot-swap bays that accept Gen4 NVMe, SATA or SAS drives, plus two additional 2.5" rear bays for SATA or SAS. This bay count and protocol mix is the primary factor when matching the system to storage-intensive workloads such as software-defined storage or database clusters.
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| Product | |
|---|---|
| Brand name | GIGABYTE |
| Model name | R283-S90-AAE3 |
| Target workload | General Purpose Server |
| Processor | |
| Processor | Supports 4th/5th Generation Intel Xeon Scalable and Intel Xeon CPU Max Series Processor |
| Processor socket | LGA 4677 |
| Preinstalled processor | No CPU Installed |
| Max supported CPUs | 2 |
| Processor details | Dual processor, TDP up to 350 W |
| Chipset | Intel C741 |
| Memory | |
| Installed RAM | No Memory Installed |
| RAM slots | 32 × 288Pin |
| Supported memory | 5th Gen Intel Xeon: RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC) 4th Gen Intel Xeon: RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC) Intel Xeon Max Series: RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC) |
| Memory channels | 8 Channel |
| Storage | |
| Preinstalled storage | No Storage Installed |
| Hot-swap drive bays | Front hot-swap: 12 × 3.5 in/2.5 in Gen4 NVMe/SATA/SAS - (8 x NVMe from CPU_0, 4 x NVMe from CPU_1) Rear hot-swap: 2 × 2.5 in SATA/SAS |
| Graphics | |
| Graphics processor | Aspeed AST2600 |
| Connectivity | |
| Primary LAN controller | Intel I350-AM2 |
| Top LAN speed | 1 Gigabit |
| Ports & slots | |
| PCIe slots | 5 x FHHL PCIe Gen5 x16 slots 2 x OCP NIC 3.0 PCIe Gen5 x16 slots |
| Front USB ports | 2 x USB 3.2 Gen1 ports (Type-A) |
| DisplayPort connectors | 1 x Mini DisplayPort |
| Rear USB ports | 2 x USB 3.2 Gen1 ports (Type-A) |
| Ethernet port | 2 |
| Extra ports | 1 x MLAN |
| Power | |
| Power supply | 1+1 2000 W 80 PLUS Platinum redundant power supplies |
| Size & build | |
| Form factor | 2U Rackmount |
| Product dimensions | 3.44 in × 17.24 in × 32.09 in |
| Product weight | 64.95 lb (29.5 kg) |
| Shipping weight | 30.00 kg |
| Package size | 1077 × 679 × 300 mm |
| In the box | |
| In the box | 1 x R283-S90-AAE3 2 x CPU heatsinks 1 x Mini-DP to D-Sub cable 6 x Carriers 1 × 2-Section Rail kit |
| Environment & compliance | |
| Temperature range | Operating temperature: 10 °C to 35 °C Non-operating temperature: -40 °C to 60 °C |
| Humidity range | Operating humidity: 8%-80% (non-condensing) Non-operating humidity: 20%-95% (non-condensing) |
| More details | |
| Registered status | Yes |
| Button count | 1 x NMI button 1 x Reset button |
| Indicator lights | 1 x Power button with LED 1 x ID button with LED 2 x LAN activity LEDs 1 x Storage activity LED 1 x System status LED |
| Fan configuration | 4 × 80 × 80 × 38 mm (18,300 rpm) |
Align each processor using the socket notches, lower the load plate, then torque the retention screws in a diagonal sequence; skipping the diagonal pattern leaves uneven pressure and causes boot failures.
The Aspeed AST2600 management controller and the hot-swap drive backplanes are the only active parts not covered by the dual-processor design; plan to replace a failed backplane or BMC module before the CPUs or memory.
Thermal headroom in the 2U chassis becomes the bottleneck; the front 12-bay NVMe backplane and rear 2.5-inch bays restrict airflow, so CPU throttling occurs before power or memory bandwidth limits are reached.
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