AVGPC 2U 24-Bay 2x Xeon 4310 128GB DDR4 1TB NVME 2x 8TB SSD
- 128 GB
- 1 TB
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1U rack server with dual Xeon 4410y 12-core CPUs, 256 GB DDR5 memory and 7.68 TB enterprise SATA SSD storage
The HPE ProLiant DL360 Gen11 fits a dual-processor Xeon platform into a single rack unit. It targets organisations running databases, virtualisation hosts or mixed enterprise applications that need dense compute with redundant power and remote management built in.
Two Xeon Silver 4410y processors each provide 12 cores at 2.00 GHz with 30 MB cache and 3.90 GHz turbo. The system populates 256 GB across eight 32 GB DDR5-4800 ECC buffered modules. Redundant hot-swappable power supplies keep workloads running during a module failure.
Storage arrives as four 1.92 TB 2.5-inch SATA III SSDs totalling 7.68 TB behind an MR408i-o Gen11 controller with 4 GB cache. A 16-core Windows Server 2022 Standard licence is included for physical or lightly virtualised deployments. Memory and drives ship separately and require installation before use. iLO 6 with Intelligent Provisioning handles remote deployment and monitoring. An embedded four-port 1 GbE OCP3 adapter provides baseline connectivity. Rail kit is supplied for rack mounting.
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| Product | |
|---|---|
| Product type | Rack |
| Processor | |
| Processor | Intel Xeon |
| Max supported CPUs | 2 |
| Memory | |
| Type of memory | DDR5 |
| Maximum RAM capacity | 256 GB |
Power down the 1U chassis, open the top cover, seat each 32 GB DDR5-4800 ECC buffered DIMM into the CPU memory slots, then insert the four 1.92 TB 2.5-inch SATA SSDs into the front hot-swap bays until they click. The step often missed is enabling the MR408i-o storage controller in UEFI before the OS sees the 7.68 TB array.
The dual hot-swap power supplies and the four enterprise SATA SSDs are the primary field-replaceable units; fans and the iLO 6 management module can also be swapped without downtime.
The 1U form factor's cooling capacity reaches its ceiling before the processors hit their maximum turbo, causing the firmware to throttle clocks to stay within the chassis thermal envelope.
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