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Intel Xeon Gold 6242R processor tray silver heatspreader gold contacts

Intel

Intel Xeon Gold 6242RProduct cpu accessory 20-core 3.10 GHz

SKU CH-W4AH-4Y36W MPN 6242RProduct

A 20-core Xeon processor running at 3.10 GHz with 40 threads and 35.75 MB L3 cache for Socket 3647 platforms

  • 20 cores and 40 threads accelerate parallel workloads
  • 10 GHz base clock with 4.10 GHz overclocking speed boosts single-thread performance
  • 75 MB L3 cache reduces memory latency for large datasets
  • 14 nm process technology balances density and power efficiency
  • 205 W TDP at 76 °C thermal spec enables sustained high loads

20-Core Xeon Gold Processor

The Intel Xeon Gold 6242R is a 20-core server processor built for multi-threaded workloads in data-centre and cloud environments. It delivers 40 threads at a 3.10 GHz base frequency with a 4.10 GHz maximum turbo frequency. The 14 nm design targets mainstream compute, network and storage tasks.

Socket 3647 Compatibility

This CPU requires a motherboard equipped with the Socket 3647 interface. The physical and electrical specification is the single factor that determines whether the processor can be installed and operated in a given platform.

205 W Thermal Design Power

The 205 W TDP defines the sustained heat output that the cooling solution must dissipate. With a 76 °C maximum case temperature, the processor handles heavy multi-core loads when paired with adequate server-grade cooling; it is not suited for chassis or coolers rated below this thermal envelope.

How it compares

Measured against everything we stock in Processor Accessories, at today’s prices. Recalculated every night.

Price $1,713.99
Pricier than about 92% of the 310 comparable items (median $73.99).

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Specifications

Product
Brand nameIntel Corporation

Questions about this item

How does the 3.10 GHz base clock translate to real-world throughput on this 20-core Xeon Gold 6242R?

The processor runs at 3.10 GHz base with a 4.10 GHz turbo frequency across 20 cores and 40 threads, delivering 35.75 MB L3 cache for data-intensive workloads.

What does the Socket 3647 interface determine for platform limits?

Socket 3647 enables up to four-socket scalability and connects the 14 nm, 205 W chip to the platform power and memory subsystem.

What physical clearance and cooling does the 205 W TDP and 76 °C thermal spec require?

A 205 W TDP and 76 °C maximum case temperature demand a server-grade heatsink or liquid cooler with adequate airflow in a chassis that fits the Socket 3647 package.

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