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JunPus International Co., Ltd.

JunPus JP-DX1 Nano Diamond Thermal Paste 1KG

SKU CH-2P3Y-MMRMZ

Nano-diamond thermal compound with 16 W/m-K conductivity, -40 °C to 240 °C operating range and 1 kg volume for high-performance cooling

  • High thermal conductivity of 16 W/m-K for efficient heat transfer
  • Low thermal impedance of 0.05 cm²/W reduces resistance between surfaces
  • Stable performance from -40 °C to 240 °C recommended range
  • Non-curing formula stays workable up to 4 years on the CPU
  • Includes razor blade for easy, precise application

Professional-grade thermal compound for system

JunPus JP-DX1 Nano Diamond Thermal Paste is a high-performance thermal interface material designed for PC enthusiasts and technicians who demand reliable heat transfer. The grey, non-curing grease uses nano-diamond particles to achieve a thermal conductivity of 16 W/m-K. It remains stable across a peak operating range of -50°C to +250°C.

Thermal conductivity of 16 W/m-K defines cooling

This single figure determines whether the paste can handle your specific heat load, from mainstream CPUs to heavily overclocked processors. With a low thermal impedance of 0.05 cm²/W and specific gravity of 2.7 g/cm³, the compound fills microscopic gaps efficiently. It is not suited for buyers who require electrically conductive paste or sub-ambient cooling setups.

Included razor blade enables precise.

The bundled tool lets you spread a thin, even layer directly from the 1 kg container without separate purchases. Non-corrosive, non-toxic and non-flammable properties mean safe handling on all common metal surfaces. The paste resists drying for up to four years on the CPU and stores for three years before use.

How it compares

Measured against everything we stock in Thermal Paste, at today’s prices. Recalculated every night.

Price $1,062.99
Pricier than about 99% of the 498 comparable items (median $12.99).

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Specifications

Product
Brand nameJunpus
Product lineJP-DX1
Model nameJP-DX1

Questions about this item

What does 16 W/m·K thermal conductivity mean for actual CPU temperatures?

It indicates very high heat-transfer capability; in practice it lowers the thermal resistance between die and cooler, helping keep peak core temperatures closer to the coolant temperature under heavy load.

How does the 0.05 cm²/W thermal impedance limit real-world performance?

That figure represents the resistance of a standard-thickness layer; thinner application reduces the absolute resistance further, but the paste itself will not be the bottleneck in most desktop cooling setups.

What does the 1 kg syringe need to fit or mount on a typical build?

The package includes a razor-blade spreader; you only need a clean, flat mating surface on the CPU heat-spreader and cooler base — no special brackets or tools are required.

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