NVIDIA Jetson AGX Orin 64GB Development Board 945137300050000
- 12-core Arm Cortex-…
- 64 GB 256-bit LPDDR…
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Two pre-soldered ESP32-S3 boards with 8MB flash, 2MB PSRAM, 240MHz dual-core processor, 36 GPIOs, 2.4GHz Wi-Fi and Bluetooth 5, plus two 44-pin expansion boards that double each GPIO
The KEHIPI ESP32-S3 N8R2 kit supplies two pre-soldered 44-pin development boards and two matching expansion boards. Each module integrates an LX7 dual-core processor running at up to 240 MHz with 512 KB TCM SRAM and 36 programmable GPIOs. The package targets makers who need ready-to-code hardware for Wi-Fi and Bluetooth 5 edge applications.
The ESP32-S3 chip combines 2.4 GHz Wi-Fi 802.11 b/g/n at 40 MHz bandwidth with Bluetooth 5 LE and Mesh, including Coded PHY for long-range links and 2 Mbps PHY for higher throughput. RF performance remains stable under high temperature, and the board draws power from either USB-to-UART or the native USB port. The 1.6 mm PCB and black-green finish complete the compact design.
The included breakout boards convert each GPIO into two usable pins, effectively doubling I/O availability without changing the MCU. This suits projects that exhaust the native 36 GPIOs on sensors, displays or actuators. Builders needing more than 8 MB Flash or 2 MB PSRAM, or requiring wired Ethernet, should evaluate alternative modules.
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Plug a USB-C cable into the board's USB port; the onboard USB-to-UART bridge appears as a serial port so you can flash firmware immediately.
No scheduled maintenance is required; keep the PCB free of dust and moisture, and reflow any cracked solder joints on the expansion headers if they loosen after repeated use.
The LX7 dual-core processor will throttle or become unstable once its junction temperature exceeds the rated maximum, so sustained full-speed loads need adequate airflow or a heatsink.
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