Kingston Technology Corp. KSM32SES8/8HE 8GB DDR4 3200 CL22 ECC 1Rx8 260-pin SoDIMM server RAM
- 8 GB
- DDR4 3200
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16 GB DDR4 ECC SoDIMM runs at 3200 MHz with CL22 latency for server workloads
Capacity 16GB
Rank 1Rx8
Model Hynix, C Die Revision
This 16 GB DDR4-3200 module brings ECC protection and unbuffered operation to compatible servers and workstations. It runs at 3200 MHz with CL22 latency and a 1.20 V supply. The single-rank 1Rx8 design fits a standard 260-pin SoDIMM slot. No heat spreader is included.
Suits administrators adding ECC memory to systems that accept unbuffered DDR4 SoDIMMs. Builders whose platforms require registered DIMMs or non-ECC modules should look elsewhere. Laptops or desktops without ECC support in the BIOS will not benefit from the error-correction feature.
The DDR4-3200 speed grade with CL22 timing and 260-pin SoDIMM form factor determines fit and performance. Verify that the target system supports this exact speed, voltage and unbuffered ECC configuration before purchase.
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| Product | |
|---|---|
| Brand name | Kingston |
| Model name | KSM32SES8/16HC |
| Total capacity | 16 GB |
| Product type | 260-Pin DDR4 SO-DIMM |
| Performance | |
| Rated speed | DDR4 3200 (PC4 25600) |
| Memory | |
| CAS latency | CL22 |
| ECC support | Yes |
| Buffer type | Unbuffered |
| Memory rank | 1Rx8 |
| Memory profiles | Intel XMP 2.0 |
| Heat spreader | No |
| Power | |
| Rated voltage | 1.2 V |
| Size & build | |
| Shipping weight | 1.50 kg |
| Package size | 127 × 94 × 8 mm |
Other versions of this model
Align the notch on the module with the slot key, press firmly until the side clips click, then verify in BIOS that the 3200 MHz speed and ECC function are active — many forget to enable the XMP 2.0 profile for the rated 3200 MT/s.
No periodic maintenance is required; the module carries a lifetime limited warranty, so replacement would only occur if a memory test reports uncorrectable ECC errors or the server platform is upgraded beyond DDR4.
The CL22 latency at 3200 MHz sets the bandwidth ceiling; sustained workloads will hit that timing limit before the 1.20 V thermal envelope becomes a constraint.
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