ORVIX TP-3 Thermal Pad 100 x 100 x 1.0 mm cpu accessory
A 1.0 mm thick, 100 x 100 mm silicone thermal pad that compresses easily to fill uneven gaps on CPUs, GPUs, RAM and chipsets while remaining electrically insulating
- Thinner pad reduces thermal resistance
- 0 mm thickness minimises heat-transfer distance
- Soft silicone filler conforms to uneven chip heights
- Electrically insulating material prevents short circuits
- Vibration-damping pad protects components during transport
Purpose and audience
The ORVIX TP-3 is a silicone-based thermal pad designed to transfer heat from components such as RAM, chipset ICs or graphics cards. It suits builders who need a soft, electrically insulating gap filler that can be cut to shape.
Thickness and thermal resistance
At 1.0 mm thick the pad minimises thermal resistance, but the very low hardness makes installation more demanding than firmer pads. Users should consult the manual for handling guidance before fitting.
Softness and cutting
The extremely soft compound conforms to uneven surfaces and bridges height differences between closely spaced chips, and it can be trimmed to the required dimensions with simple tools.
How it compares
Measured against everything we stock in Processor Accessories, at today’s prices. Recalculated every night.
- Price $17.99
- Cheaper than about 79% of the 310 comparable items (median $73.99).
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Specifications
| Product | |
|---|---|
| Brand name | ORVIX |
Questions about this item
Should I choose the 1.0 mm thickness or a different one?
The pad is supplied at 1.0 mm; its soft silicone blend compresses well, so this single thickness suits gaps that match or slightly exceed 1.0 mm.
What does the 100 x 100 mm size mean when I fit it?
You receive a 100 x 100 mm square that can be cut to the exact shape of a GPU VRAM cluster, CPU die, or laptop chipset.
How does the silicone interface perform electrically?
The pad contains no metal particles, is electrically insulating and non-capacitive, so contact with live components causes no short circuits.
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