Prolimatech PRO-PK1-1.5G thermal paste 1.5 g
High-conductivity 10.2 W/m-K thermal compound with low dry-out for stable CPU or GPU cooling
- DetailsMaterial Specification: Al 60 to 85(wt%) ZnO 15 to 25(wt%) O
- Key featuresExcellent long-term stability Not electrically conductive No
- Low thermal impedance of 0.017 °C·in²/W improves heat transfer
- Thermal conductivity of 10.2 W/m·K draws heat away efficiently
- Non-electrically conductive formula prevents short circuits
- Non-corrosive composition protects metal surfaces over time
- Low dry-out characteristic maintains performance for longer
Thermal paste for CPU and GPU cooling
Prolimatech PRO-PK1-1.5G is a 1.5 g syringe of thermal compound built for desktop processors and graphics cards. The mixture uses aluminium and zinc oxide in an oil carrier with an antioxidant. It is non-electrically conductive and non-corrosive, making it safe for direct-die and heat-spreader applications.
Replaces dried or stock paste when temperatures
Swapping aged compound for this formula cuts thermal impedance to 0.017 degrees -in2/W and raises conductivity to 10.2 W/m - degrees. The jump is worth it when a cooler runs louder than expected or when a fresh build needs reliable contact without a burn-in period.
Check syringe volume and mounting pressure before
The 1.5 g fill covers several standard CPU installations but may fall short for large cold plates or multiple GPUs. Ensure the cooler applies even pressure so the 310000 Cps viscosity spreads thin without gaps, and confirm the surface is clean of old residue.
How it compares
Measured against everything we stock in Thermal Paste, at today’s prices. Recalculated every night.
- Price $8.99
- Cheaper than about 75% of the 498 comparable items (median $12.99).
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Specifications
| Product | |
|---|---|
| Brand name | Prolimatech |
| Model name | PRO-PK1-1.5G |
| Size & build | |
| Shipping weight | 0.03 kg |
| Package size | 102 × 20 × 10 mm |
Questions about this item
How much thermal paste does the 1.5 g syringe provide for a typical CPU application?
The 1.5 g syringe contains enough compound for multiple CPU applications, with the manufacturer noting that less product is needed per use.
Does the compound require a curing period before it reaches full thermal conductivity of 10.2 W/m-K?
No burn-in time is required; the paste delivers its rated 10.2 W/m-K thermal conductivity immediately after application.
Will the aluminium and zinc oxide particles in the compound cause electrical shorts if they bridge adjacent pins?
The compound is not electrically conductive, so the Al and ZnO filler particles will not create short circuits between pins.
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