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Green rectangular SODIMM stick with black chips and gold edge contacts

SAMSUNG

SAMSUNG 16GB DDR4 2666MHz CL19 260-pin SODIMM laptop RAM

SKU CH-K209-6AS8F

16 GB DDR4 SODIMM runs at 2666 MHz with CL19 latency and 1.2 V operation for laptop upgrades

  • 16 GB capacity handles demanding multitasking
  • 2666 MHz DDR4 speed delivers responsive performance
  • CL19 latency supports smooth data access
  • 2 V operation reduces power draw
  • 260-pin SODIMM form factor fits compatible laptops

16 GB DDR4 SODIMM

This Samsung laptop memory module provides 16 GB of DDR4 capacity in a 260-pin SODIMM form factor. It operates at 2666 MHz with CL19 latency and a low 1.2 V voltage. The unbuffered, non-ECC design is built for standard laptop and all-in-one PC upgrades.

Upgrade compatibility

It suits owners of laptops or all-in-one PCs that accept DDR4 SODIMMs running at 2666 MHz. Buyers who need ECC error correction, registered modules, or a different pin count should look elsewhere.

260-pin DDR4 interface

The module uses the 260-pin DDR4 SODIMM interface, which determines whether it fits the memory slot. Verify that your system requires this exact pin count and DDR4 technology before purchasing.

How it compares

Measured against everything we stock in Laptop RAM, at today’s prices. Recalculated every night.

Price $98.99
Pricier than about 61% of the 2,079 comparable items (median $70.99).

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Specifications

No published specifications for this item yet.

Questions about this item

Does the 260-pin SODIMM module require any periodic cleaning or replacement?

The module has no moving parts and is rated for a limited lifetime warranty, so no scheduled maintenance or replacement is needed.

What is the first limit reached when the memory runs continuously at 2666 MHz?

The 1.2 V operating voltage and CL19 latency are fixed specifications; sustained loads stay within those electrical and timing boundaries.

How much heat and power does the 16 GB stick draw during all-day operation?

DDR4 at 1.2 V reduces power consumption by up to 40 % compared with previous generations, lowering heat output for extended use.

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