Team Group CTCMD564G6400HC32AQC01 64GB (4×16GB) DDR5 6400 CL32 ECC RDIMM server RAM
- 64 GB (4 × 16 GB)
- DDR5 6400
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64 GB quad-channel DDR5 RDIMM kit with ECC, CL32 latency and XMP 3.0 or EXPO profiles
Speed DDR5 6000 (PC5 48000)
This 64 GB kit ships as four 16 GB DDR5 RDIMMs rated for 6000 MT/s at CL32 with a 1.40 V operating voltage. Registered design and on-die ECC target workstation and server platforms built around Intel W790 or W890 chipsets and AMD TRX50 or WRX90 platforms. Buyers who need unbuffered UDIMMs or consumer SO-DIMM form factors cannot use these modules.
Professional heat spreaders cover each module to manage the thermal load of 1.40 V operation during sustained workloads. Registered buffering adds a clock cycle of latency but reduces electrical loading on the memory controller, helping stability at the rated 6000 MT/s speed. The kit draws more power than standard 1.1 V JEDEC parts, so adequate case airflow is required.
Intel XMP 3.0 and AMD EXPO profiles store the 6000 MT/s CL32 32-39-39-84 timing set for one-click configuration on supported motherboards. Team Group’s patented IC classification (Taiwan I751093, US 11488679) validates each Hynix die before assembly, reducing early-life failures. Systems without XMP 3.0 or EXPO support must be tuned manually in firmware.
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| Product | |
|---|---|
| Brand name | Team |
| Product line | T-Create Master |
| Model name | CTCMD564G6000HC32AQC01 |
| Part number | CTCMD564G6000HC32AQC01 |
| Total capacity | 64 GB (4 × 16 GB) |
| Product type | 288-Pin DDR5 RDIMM |
| Performance | |
| Rated speed | DDR5 6000 (PC5 48000) |
| Processor | |
| Chipset | AMD TRX50/WRX90 Intel W790/W890 |
| Memory | |
| CAS latency | CL32 |
| Memory timings | 32-39-39-84 |
| ECC support | Yes |
| Buffer type | Registered |
| Kit configuration | Quad Channel Kit |
| Memory profiles | Intel XMP 3.0 and AMD EXPO |
| Power | |
| Rated voltage | 1.4 V |
| Size & build | |
| Shipping weight | 0.13 kg |
| Package size | 160 × 115 × 15 mm |
Other versions of this model
Insert all four 16 GB modules into the correct quad-channel slots, then enter the BIOS and enable the Intel XMP 3.0 or AMD EXPO profile to run at 6000 MT/s with 1.40 V.
The aluminium heatspreader is passive and requires no service; the on-die ECC logic is built into each Hynix IC and lasts for the module's lifetime without user intervention.
The patented IC sorting and the high-efficiency heatspreader are designed to keep the modules within specification at 1.40 V during continuous 6000 MT/s operation.
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