MSI 939-S336-002 1U barebone server AM5 B650 4 DDR5 2×10G 2×2.5" 450W redundant
- Single AMD Ryzen 70…
- 1U
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4U rackmount barebone supports up to 10 double-wide GPUs, 32 DDR4-3200 DIMM slots for 8 TB, and 12 hot-swap drive bays with four NVMe ports
The TYAN B7129F83AV8E4HR-N is a 4U rackmount barebone server built for AI, machine learning and high-performance computing workloads. It targets system integrators and data-centre teams who need a dual-socket Intel Xeon platform with massive GPU density and flexible storage options. No CPUs, memory or drives are installed, allowing full customisation for specific compute requirements.
The chassis operates between 10 °C and 35 °C and survives non-operating temperatures from -40 °C to 70 °C. A redundant 4800 W power supply delivers the headroom needed for dual 270 W TDP processors and up to ten double-wide GPU cards. High-density component packing and redundant cooling mean audible fan noise is significant, as expected in a 4U GPU-dense rackmount environment.
The single specification that decides fit is the ability to host ten double-wide GPUs with even CPU attachment or single-root topology via BIOS setting. This is enabled by dual PLX PEX88096 PCIe switches and the C621A chipset on a dual LGA 4189 platform. Buyers who need fewer than ten GPUs or a different interconnect topology should evaluate alternative chassis.
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| Product | |
|---|---|
| Brand name | TYAN |
| Model name | B7129F83AV8E4HR-N |
| Target workload | AI/ML/HPC |
| Processor | |
| Processor | 3rd Gen. Intel Xeon Scalable Processor |
| Processor socket | LGA 4189 |
| Preinstalled processor | No CPU Installed |
| Max supported CPUs | 2 |
| Processor details | Max up to 270 W (TDP) |
| Chipset | Intel C621A |
| Memory | |
| Installed RAM | No Memory Installed |
| RAM slots | 32 × 288Pin |
| Maximum supported memory | 8 TB |
| Supported memory | DDR4 3200 |
| Memory channels | 8 Channel |
| ECC support | Yes |
| Storage | |
| Preinstalled storage | No Storage Installed |
| SATA and RAID support | RAID 0/1/10/5 (Intel RSTe) |
| M.2 slots | (1) 2280 (by PCIe 3.0 x4) M.2 slot on MB / (1) 2280 (by PCIe 4.0 x1) M.2 slot on PCIe I/O board (2) SFF-8654 for (4) NVMe ports |
| Hot-swap drive bays | (12) 3.5 in/2.5 in Hot-Swap HDD/SSDs w/ (4) NVMe |
| Graphics | |
| Graphics processor | All GPU connected to CPUs evenly |
| Connectivity | |
| Primary LAN controller | Realtek RTL8211E |
| Top LAN speed | 1 Gigabit |
| Ports & slots | |
| Front USB ports | 2 x USB 3.0 |
| Serial ports | 1 |
| VGA ports | 1 |
| Rear USB ports | 2 x USB 3.0 |
| Ethernet port | 1 |
| Size & build | |
| Form factor | 4U Rackmount |
| Product dimensions | 6.9 in × 17.26 in × 32.68 in |
| Product weight | 101.4 lb (46 kg) |
| Shipping weight | 48.99 kg |
| Package size | 1143 × 635 × 432 mm |
| Environment & compliance | |
| Temperature range | Operating Temp.: 10 °C to 35 °C (50 °F to 95 °F) Non-operating Temp.: -40 °C to 70 °C (-40 °F to 158 °F) |
| Humidity range | 90%, non-condensing at 35 °C |
Align each processor with the socket notches, lower the load plate, and torque the four captive screws in a cross pattern to the specified value; the step most often missed is applying the correct torque sequence so the CPU seats evenly across all 4189 contacts.
The hot-swap power modules can be replaced individually without shutting down the server; plan to swap a module if its status LED shows a fault or after the manufacturer's rated service hours.
The operating temperature ceiling of 35 °C is typically the first constraint; inlet air above that threshold will trigger thermal throttling before power or memory bandwidth saturates.
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