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Silver-grey thermal putty in a 20 g syringe

UPSIREN

UPSIREN U6 PRO Thermal Putty 20 g

SKU CH-YM33-QT3RD

Fully cured thermal putty that fills gaps completely, stays tacky without drying out, and suits automated dispensing for GPU and memory cooling

Weight 20g

  • High thermal conductivity for efficient heat transfer
  • Naturally tacky surface ensures low contact resistance
  • Fully cured formula prevents oil bleeding over time
  • High compressibility fills gaps completely without drying out
  • RoHS compliant and halogen free for restricted substance applications

UPSIREN U6 PRO Thermal Putty

UPSIREN U6 PRO is a 20 g thermal putty designed as a high-performance replacement for standard thermal pads. It targets technicians and advanced builders who need a fully cured, non-drying material for GPU memory modules, VRM heatsinks, or other uneven component stacks where pads leave air gaps.

Replacing thermal pads with putty

This putty replaces pre-cut thermal pads when those pads cannot fully conform to stepped surfaces or varying gap heights. The jump is worth it when a pad bridges poorly, causing hotspots, or when rework demands a material that compresses completely without oil bleed and maintains stable contact resistance over time.

Capacity and headroom for gap filling

The 20 g syringe provides enough volume for multiple GPU or memory module applications, comfortably handling typical VRAM and VRM arrays. It runs out when covering large-area heatsinks or when repeated reapplications are needed for extensive repair batches.

How it compares

Measured against everything we stock in Thermal Paste, at today’s prices. Recalculated every night.

Price $18.99
Pricier than about 72% of the 498 comparable items (median $12.99).

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Specifications

No published specifications for this item yet.

Other versions of this model

3 more in the same range

Questions about this item

What gap thickness can the 20 g putty fill between a GPU die and heatsink?

The fully cured putty compresses to fully fill uneven gaps between the die and heatsink, replacing thermal pads without drying out.

How do I apply the putty without trapping air bubbles?

Dispense a thin, even layer using the syringe; the low-viscosity material spreads under pressure, so tighten the heatsink slowly in a cross pattern.

Will the putty need replacement after repeated thermal cycles?

No, the RoHS-compliant, halogen-free formula is fully cured with no oil-bleeding, so it maintains conductivity without drying or degrading.

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