UPSIREN UX PRO Ultra 16.8 W/m·K Thermal Putty 20 g
- 20g
- -50 to 200 °C
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High-conductivity 16.8 W/mK thermal putty replaces pads up to 3 mm thick on GPUs and memory, operates from -50 to 200 °C and withstands 250 °C peaks
Weight 20g
UPSIREN UX PRO Ultra is a 20 g syringe of sticky thermal compound rated at 16.8 W/m·K. It is formulated to replace soft thermal pads up to 3 mm thick on graphics cards, memory modules and similar components. The material is non-electrically conductive and cures fully without oil bleed. Operating range spans -50 °C to 200 °C with short-term tolerance to 250 °C.
Builders who need a conformable, high-conductivity interface for GPU dies, VRAM or VRM areas will benefit from the putty's tack and compression performance. It is not intended for users who require a traditional low-viscosity paste for thin CPU spreads, nor for applications needing a pre-cut pad with fixed thickness and no manual shaping.
The 20 g syringe provides enough material for several graphics-card memory and core applications, including larger dies and surrounding VRAM arrays. Coverage diminishes when filling gaps approaching the 3 mm replacement limit or when coating extensive VRM heatsink arrays across multiple cards.
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| Size & build | |
|---|---|
| Net content | 20g |
| Environment & compliance | |
| Continuous-use temperature | -50 to 200 °C |
Other versions of this model
Any GPU or memory chip that currently uses a soft thermal pad up to 3 mm thick can be serviced with this putty; the 20 g syringe covers multiple such components.
Yes, the putty’s conductivity is at least three times higher than typical pads, so it improves heat transfer even with an older heatsink.
Monitor GPU core and memory temperatures under load; they should stay within the -50 °C to 200 °C operating range and show lower peaks than with the previous pad.
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