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Small black rectangular UQFN28 semiconductor chip with silver pads

YINGHUA

YINGHUA 33CK64MC102-E M6 UQFN28 semiconductor

SKU CH-878B-Q38Q2

Integrated circuit in UQFN28 package, new condition, first listed February 21, 2025

  • Product typeICs Semicoductors
  • UQFN28 package enables compact PCB layouts
  • IC semiconductor delivers core logic functions
  • 33CK64MC102-E M6 part number ensures exact identification
  • New condition guarantees factory-fresh reliability
  • First listed February 21, 2025 confirms current production

YINGHUA 33CK64MC102-E M6 IC

This YINGHUA semiconductor is an integrated circuit for electronic assemblies. It serves engineers and procurement teams sourcing components for board-level designs. The part carries the 33CK64MC102-E M6 designation and is supplied in new condition. It fits workflows that require this specific device identifier.

UQFN28 package for surface mounting

The component uses a UQFN28 package with 28 contacts for surface-mount placement. This outline supports automated assembly and a compact footprint on the printed circuit board. The leadless design reduces parasitic inductance and suits dense layouts. Daily handling follows standard SMT pick-and-place and reflow processes.

Replaces earlier 33CK64MC102 revisions

This device supersedes prior revisions of the 33CK64MC102 series for designs that require the M6 stepping. The jump is worth it when a bill of materials calls for the updated marking or when qualification data references the 2025 listing date. It is not for builds that must stay on an older stepping or a different package variant.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $59.99
Pricier than about 71% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What interface does the UQFN28 package provide for board connection?

The UQFN28 package provides 28 pins for surface-mount soldering directly onto the PCB.

What PCB footprint does the UQFN28 package require?

The UQFN28 package requires a 28-pad land pattern matching the 28-lead ultra-thin quad flat no-lead outline.

How is the UQFN28 device mounted, and what step is often missed?

Mount by reflow soldering the 28 bottom pads; the commonly missed step is applying solder paste to the central thermal pad for proper grounding and heat transfer.

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