YINGHUA 5CGXFC7D6F31I7N FPGA-Field Programmable Array FBGA-896 semiconductor
Field-programmable gate array in an 896-ball FBGA package with speed grade 31 for custom logic designs
- Product typeICs Semicoductors
- FPGA enables custom logic design
- 896-pin FBGA package suits dense PCB layouts
- Industrial-grade operation across wide temperature ranges
- New condition ensures full factory specification compliance
FPGA for custom logic design
The YINGHUA 5CGXFC7D6F31I7N is a field-programmable gate array supplied in an FBGA-896 package. It targets engineers implementing custom digital logic, signal processing or prototyping tasks that require reconfigurable hardware. The device suits development boards and embedded systems needing programmable fabric. Buyers needing a fixed-function ASIC or a microcontroller with integrated peripherals should look elsewhere.
Thermal and power behaviour
Power draw varies with the logic utilisation, clock frequency and I/O activity programmed into the fabric. Junction temperature must stay within the manufacturer’s specified limits for reliable operation. A heatsink or forced-air cooling is typically required when the design exercises a large portion of the 896 balls. No acoustic noise is produced by the component itself.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $1,768.99
- Pricier than about 93% of the 1,027 comparable items (median $34.99).
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
How is the 896-ball FBGA package installed, and what step is most often missed?
The 896-ball FBGA package requires reflow soldering onto a matching PCB footprint; the step most often missed is applying the correct solder-paste stencil thickness and performing X-ray inspection afterwards to verify hidden joints.
What maintenance or replacement will the 5CGXFC7D6F31I7N FPGA need later?
The device itself has no user-serviceable parts; replacement is only required if the FPGA fails or a design change demands a different configuration, at which point the entire 896-ball BGA must be desoldered and a new unit reflowed.
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