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Small square black BGA chip with 144 solder balls

YINGHUA

YINGHUA AD9361BBCZ RF Transceiver BGA-144

SKU CH-MEQ0-09VJJ

RF transceiver in 144-ball BGA package for software-defined radio applications

  • Product typeICs Semicoductors
  • RF transceiver enables software-defined radio designs
  • BGA-144 package suits high-density board layouts
  • 9361 model supports wideband signal processing
  • New condition ensures factory-fresh reliability
  • First listed February 21 2025 confirms current availability

YINGHUA AD9361BBCZ RF Transceiver

The YINGHUA AD9361BBCZ is an RF transceiver supplied in a BGA-144 package for semiconductor integration. It serves engineers and system designers building radio-frequency signal chains in new electronic equipment.

Upgrading RF Front-End Integration

This component replaces earlier discrete RF implementations or less integrated transceiver ICs when a design demands a single-chip solution. The jump is worth it when board space, bill-of-materials count or signal-chain consistency must be reduced in a new development cycle.

BGA-144 Board Integration

The 144-ball grid array requires controlled-impedance PCB layout and precise reflow soldering for reliable connections. It frees the designer from sourcing separate mixer, filter and amplifier die while demanding careful power-supply decoupling and thermal management on the host board.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $193.99
Pricier than about 85% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What PCB pad count and package style does the AD9361BBCZ require for surface-mount assembly?

The device uses a 144-ball BGA footprint, so the board must provide matching pads and a compatible reflow profile for that ball count.

What is the critical step during BGA reflow that installers most often miss with this transceiver?

Applying the correct thermal profile for a 144-ball BGA without warping the package; insufficient preheat or peak temperature leads to open solder joints.

How can the AD9361BBCZ be replaced if a solder joint fails after assembly?

Removal requires a hot-air BGA rework station to reflow all 144 balls simultaneously, followed by site cleaning and reballing before a replacement unit can be placed.

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