YINGHUA ADG702BRMZ analog switch IC MSOP-8
ADG702BRMZ analog switch IC in MSOP-8 package for signal routing applications
- Product typeICs Semicoductors
- Analog switching in a compact MSOP-8 package
- Low on-resistance for efficient signal routing
- Single-supply operation simplifies power design
- Fast switching speeds suit precision applications
- Break-before-make action prevents signal shorting
ADG702BRMZ analog switch IC
The ADG702BRMZ is a new analog switch integrated circuit supplied in an MSOP-8 package. It is intended for engineers and procurement specialists sourcing discrete semiconductor components for signal-routing applications.
MSOP-8 package constraints
The MSOP-8 outline limits the device to eight pins, which defines the maximum channel count and control logic available in this footprint. Board layouts must accommodate the fine lead pitch and the thermal characteristics of this small surface-mount package.
ADG702BRMZ part number
The ADG702BRMZ part number determines the exact electrical specification, switch configuration and voltage range for the design. Verify that this specific model matches the required on-resistance, bandwidth and supply-voltage parameters before purchase.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $26.99
- Cheaper than about 60% of the 1,027 comparable items (median $34.99).
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
Should I choose the ADG702BRMZ or a different version for my design?
The ADG702BRMZ is the specific analog switch IC listed; select this exact part number when your schematic calls for it.
What does the 702 designation mean for circuit performance?
The 702 identifies this particular analog switch model; its electrical characteristics define the signal routing behaviour in your application.
How does the MSOP-8 package affect board layout?
The MSOP-8 package is a small 8-lead surface-mount outline that fits compact PCB footprints for dense designs.
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