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YINGHUA

YINGHUA ATSAML11D15A-MF 24-VQFN semiconductor

SKU CH-WQPD-4JEA9

ATSAML11D15A-MF 24-VQFN semiconductor for embedded control applications

  • Product typeICs Semicoductors
  • ATSAML11D15A-MF 24-VQFN microcontroller
  • New condition, ready for production use
  • 24-pin VQFN package for compact PCB layouts
  • IC semiconductor type for embedded applications
  • First listed by manufacturer in June 2026

YINGHUA ATSAML11D15A-MF semiconductor

The YINGHUA ATSAML11D15A-MF is a new IC semiconductor supplied in a 24-VQFN package. It is intended for engineers and procurement specialists sourcing components for embedded designs. Buyers needing a different pin count or package style should select another part.

24-VQFN package constraint

The decisive specification is the 24-VQFN footprint, which fixes the PCB land pattern and routing density. Verify that your layout matches this exact package before ordering.

Build integration notes

This device mounts directly onto a prepared PCB and requires compatible power rails and peripheral connections defined in the datasheet. It frees board space compared with larger packages while delivering the specified IC function.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $22.99
Cheaper than about 67% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What does the 24 in the 24-VQFN package mean for board layout?

The 24 indicates the pin count, so the footprint requires 24 solder pads arranged in a very thin quad flat no-lead outline.

Which interface or standard does the ATSAML11D15A-MF use and what does it limit?

The device is an IC semiconductor; its electrical interface is defined by the 24-pin VQFN package and the internal logic, not by an external bus standard.

What physical space and mounting does the 24-VQFN package need?

It needs a 24-pad VQFN footprint on the PCB with clearance for the very thin package height and thermal pad underneath.

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