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YINGHUA

YINGHUA CY7C1041CV33-12ZXI TSOP44 semiconductor

SKU CH-2R8P-GDZMB

A CY7C1041CV33-12ZXI static RAM in TSOP-44 package, new and listed in February 2025

  • Product typeICs Semicoductors
  • New static RAM IC ready for immediate design integration
  • 12 ns access speed supports timing-critical applications
  • TSOP-44 surface-mount package enables dense PCB layouts
  • Industrial-grade semiconductor built for reliable operation
  • Fresh 2025 manufacturer listing ensures current production status

CY7C1041CV33-12ZXI TSOP44 semiconductor

The CY7C1041CV33-12ZXI TSOP44 is a new semiconductor component supplied by YINGHUA. It arrives in a TSOP44 package marked with the 12 and 33 speed identifiers. Engineers and procurement teams use this IC for board-level repairs or production runs that require this exact part number.

Direct replacement for identical MPN

This component serves as a direct replacement for boards already designed around the CY7C1041CV33-12ZXI TSOP44 footprint. The jump is worth it when the existing IC has failed or when a bill of materials calls for this specific 1041 variant. No redesign is needed because the package and pinout match the original specification.

Verify package and markings before ordering

Confirm that your PCB footprint accepts a TSOP44 package and that the required speed codes are 12 and 33. Cross-reference the full part string against your schematic or BOM to avoid mismatches. The part was first listed by the manufacturer in February 2025, so ensure your documentation reflects that revision.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $9.99
Cheaper than about 95% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What PCB footprint does the TSOP44 package of this CY7C1041CV33-12ZXI require?

The TSOP44 package needs a footprint with 44 pins arranged in the standard thin small-outline layout; verify the pad dimensions against the manufacturer datasheet before layout.

What is the correct orientation and soldering method for installing this surface-mount IC?

Align the pin-1 marker on the IC with the PCB silkscreen, then solder using a reflow profile suited to the TSOP44 body; hand-soldering each lead sequentially is the common mistake that causes bridges.

When should this semiconductor be replaced during board maintenance?

Replace the device if continuity tests show shorted or open pins, if the package shows physical cracking, or if the board fails self-test after a power-surge event.

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