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Small square black BGA chip with dense solder balls underneath

YINGHUA

YINGHUA EP4CE115F23I7N FPGA FBGA-484

SKU CH-EQ64-41Q31

A field-programmable gate array in a 484-ball FBGA package with 115K logic elements and a -7 speed grade

  • Product typeICs Semicoductors
  • High logic capacity with 115K logic elements
  • Industrial temperature range rated to 23 °C
  • 484-pin FBGA package for dense PCB layouts
  • Field-programmable architecture enables custom hardware logic

YINGHUA EP4CE115F23I7N FPGA FBGA-484

The YINGHUA EP4CE115F23I7N is a new field-programmable gate array in a 484-ball FBGA package. It provides 115K logic elements for custom digital logic implementation. Engineers and developers use this device for prototyping, signal processing and embedded control applications.

Suits logic designers needing 115K elements

This device suits designers targeting the specific 115K logic-element capacity and FBGA-484 footprint. It is not for buyers who need more logic resources, a different package style, lower power consumption or integrated transceiver blocks not present on this part.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $198.99
Pricier than about 86% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What PCB footprint does the FBGA-484 package require?

The FBGA-484 package needs a 484-ball grid array footprint with matching ball pitch and pad dimensions for surface-mount assembly.

Which solder-profile step is most often misapplied when mounting this FBGA-484 device?

Exceeding the peak reflow temperature or dwell time for the 484-ball FBGA package can damage the die; follow the manufacturer's exact thermal profile.

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