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Square green FPGA chip with gold ball-grid array 484 pins model EP4CE40F23I7N

YINGHUA

YINGHUA EP4CE40F23I7N FPGA semiconductor FBGA-484

SKU CH-PZMH-A8TAZ

Field-programmable gate array with 40 logic elements in a 484-ball FBGA package rated for 23 speed grade

  • Product typeICs Semicoductors
  • 40K logic elements enable complex digital designs
  • FBGA-484 package supports high-density board layouts
  • Industrial temperature rating ensures reliable operation
  • Cyclone IV architecture provides low-power reconfigurable logic

EP4CE40F23I7N FPGA for digital design

The EP4CE40F23I7N is a field-programmable gate array supplied in a 484-pin FBGA package. It provides 40 thousand logic elements for custom hardware acceleration, signal processing or protocol bridging. Engineers and students use it to implement parallel datapaths that software cannot meet.

Thermals, noise and power in normal use

The device is a bare semiconductor die with no integrated fan, so it produces no acoustic noise. Junction temperature stays within rated limits when the PCB includes adequate copper planes or a small heatsink. Static power draw is low at 23 MHz typical clock rates, and dynamic consumption scales with the switching activity of the instantiated logic.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $2,260.99
Pricier than about 94% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

How do I solder the FBGA-484 package onto my PCB without bridging pins?

Use a reflow oven with a lead-free profile matching the 484-ball grid; the step most people miss is applying solder paste through a laser-cut stencil aligned to the 23 mm pitch so each ball wets cleanly.

When will the EP4CE40F23I7N need replacement if it runs continuously at the rated industrial temperature?

The silicon itself has no wear-out mechanism, so replacement is only required if the board suffers physical damage or the design migrates to a larger logic density than the 40 kLE capacity.

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