YINGHUA FM25V01-GTR Storage IC SOP8
SOP8 packaged storage IC for non-volatile data retention in electronic circuits
- Product typeICs Semicoductors
- FM25V01-GTR storage IC in SOP8 package
- New condition ready for immediate circuit integration
- Semiconductor component for electronic designs
- YINGHUA branded integrated circuit
- Manufacturer listed February 21 2025
Component Identity
The YINGHUA FM25V01-GTR is a storage integrated circuit supplied in an SOP8 surface-mount package. It is intended for engineers and technicians assembling or repairing boards that require this specific non-volatile memory device.
Design Integration
Verify that the PCB footprint matches the SOP8 outline and that the supply rails meet the voltage window specified in the manufacturer datasheet. Confirm the SPI timing requirements and write-protect pin behaviour before committing the component to a production layout.
Build Practicalities
The gull-wing leads on the SOP8 body allow standard reflow soldering and straightforward visual inspection of joints. The compact outline supports dense board placement, while the exposed pins make rework with a hot-air station or fine-tip iron practical during development or field service.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $11.99
- Cheaper than about 92% of the 1,027 comparable items (median $34.99).
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
What comes in the box with the YINGHUA FM25V01-GTR and what must be sourced separately?
The component is supplied as a single SOP8 integrated circuit; any printed circuit board, solder paste, reflow equipment or programming hardware must be obtained separately.
Which version of the FM25V01-GTR should I select for a surface-mount design?
The part is offered in the SOP8 package only; choose this version when your layout calls for an 8-pin small-outline footprint.
What does the 2025 listing date tell me about using this IC in a current build?
First listed by the manufacturer in February 2025, the device is a new, current-production component suitable for fresh designs.
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