YINGHUA LAN89530AM VQFN56 semiconductor
A LAN89530AM semiconductor in a 56-pin VQFN package, listed February 21, 2025
- Product typeICs Semicoductors
- 56-pin VQFN package enables compact board layout
- LAN89530AM part number identifies the exact IC variant
- IC semiconductor function supports integrated circuit designs
- New condition guarantees factory-original specifications
- First listed February 21 2025 confirms current production status
LAN89530AM VQFN56 IC component
The YINGHUA LAN89530AM is a semiconductor IC supplied in a VQFN56 package. It is intended for engineers and procurement specialists sourcing active components for new board designs or production runs.
Suitable for new designs needing this specific
This item suits buyers who have already qualified the LAN89530AM for their schematic and bill of materials. It is not for hobbyists seeking a generic substitute, nor for projects that require a different pin count, package style or logic family.
VQFN56 package with 56 pins
The device uses a VQFN56 footprint providing 56 connections. Verify the land pattern and electrical requirements against your layout before ordering, as no other package variant is offered.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $40.99
- Pricier than about 59% of the 1,027 comparable items (median $34.99).
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
How do I solder the LAN89530AM onto a PCB using its VQFN56 package?
The VQFN56 package has 56 perimeter pads and an exposed thermal pad. Apply solder paste to all pads, place the component precisely, and reflow. The step often missed is ensuring the centre thermal pad solders fully for heat dissipation.
What maintenance or replacement will the LAN89530AM need during its service life?
As a solid-state semiconductor, the LAN89530AM has no moving parts or consumables. It requires no scheduled maintenance. Replacement is only necessary if the IC is damaged by electrical overstress or physical board failure.
What thermal limit appears first when the LAN89530AM runs continuously at high load?
The VQFN56 exposed pad is the primary heat path. Under sustained load the junction-to-board thermal resistance becomes the limiting factor first; if the PCB copper area is insufficient the die temperature will exceed its maximum rating.
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