YINGHUA PIC16F1526-I PT TQFP64 semiconductor
A PIC16F1526-I PT microcontroller in a 64-pin TQFP package for embedded control applications
- Product typeICs Semicoductors
- PIC16F1526 microcontroller in 64-pin TQFP package
- New condition semiconductor ready for immediate integration
- 16-bit architecture supports efficient embedded processing
- First listed by manufacturer in 2026
- IC type suited for electronic component designs
YINGHUA PIC16F1526-I PT TQFP64 Semiconductor
This YINGHUA semiconductor is a PIC16F1526-I PT microcontroller in a 64-pin TQFP package. It is supplied as a new electronic component for integration into custom circuit designs. Engineers and hobbyists select it for embedded control applications requiring this specific part number.
Suits developers building
This component fits projects that specify the PIC16F1526-I PT in a TQFP64 footprint. It is not suitable for designs requiring a different pin count or package style. Buyers needing an alternative core architecture or peripheral set must source a different part number.
The TQFP64 package defines the board layout
The 64-pin Thin Quad Flat Package determines the PCB footprint and soldering requirements. Verify that your schematic and layout match this exact package before ordering. The part is identified by the numbers 1526 and 64 in the supplier title.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $35.99
- Typical for this category: the median of 1,027 items is $34.99.
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
Does the 64-pin TQFP package require a specific PCB footprint for soldering?
The 64-pin TQFP package uses a standard pinout that matches common 64-lead thin quad flat pack footprints for surface-mount assembly.
What is the correct orientation for placing the PIC16F1526-I PT on the board during reflow?
Align the pin-1 indicator on the device with the corresponding mark on the PCB silkscreen before reflow; reversed placement is the most common assembly error.
How should the PIC16F1526-I PT be handled and stored before assembly to prevent later failure?
Store the devices in moisture-barrier bags with desiccant and follow the MSL level printed on the reel label; bake before reflow if the floor-life limit has been exceeded.
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