YINGHUA PIC16F1907-IPT LQFP44 semiconductor
An 8-bit PIC16F1907-IPT microcontroller in a 44-pin LQFP package for embedded control applications
- Product typeICs Semicoductors
- PIC16F1907-IPT microcontroller for embedded control
- LQFP44 package with 44 pins for surface mounting
- 2026 manufacturer listing confirms new condition
- IC semiconductor type suits digital logic designs
- Part number 1907 identifies this specific device variant
Microcontroller in LQFP44 package
The YINGHUA PIC16F1907-IPT is a 44-pin microcontroller supplied in an LQFP package for embedded control tasks. Engineers designing new boards use it to integrate core logic and I/O in a compact footprint.
Low-power operation for embedded designs
The device draws minimal current during active and sleep modes, keeping thermals negligible in enclosed assemblies. Silent operation is inherent with no moving parts required for cooling.
44-pin LQFP footprint decides fit
The 44-lead quad flat package sets the board layout and soldering requirements for the project. Buyers needing a different pin count or package style must select another part.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $15.99
- Cheaper than about 80% of the 1,027 comparable items (median $34.99).
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
How is the PIC16F1907-IPT soldered onto a board, and which step is most often missed?
Align the 44-lead LQFP44 package to the PCB pads, apply flux, then reflow or hand-solder each lead; the step most often missed is inspecting every joint under magnification for bridges.
What maintenance or replacement will the PIC16F1907-IPT need during its service life?
The device itself requires no scheduled maintenance; replacement is only needed if electrical overstress or physical damage occurs.
What limit appears first when the PIC16F1907-IPT runs continuously at full load?
The junction-temperature ceiling is reached first; adequate PCB copper area or a heatsink must keep the die within its rated thermal envelope.
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