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Small black square QFN28 chip with gold pads

YINGHUA

YINGHUA PIC16LF1826-E ML QFN28 semiconductor

SKU CH-XG4Z-7VKX4

Low-power 28-pin QFN microcontroller suited for embedded control tasks

  • Product typeICs Semicoductors
  • Low-power operation with 16LF series architecture
  • Compact 28-pin QFN package saves board space
  • Microcontroller core integrates memory and peripherals
  • New condition ensures reliable first-use performance
  • Listed by manufacturer in June 2026

Microcontroller for low-power embedded designs

The PIC16LF1826-E ML QFN28 is a new microcontroller intended for engineers building battery-operated or energy-harvesting devices. Its low-voltage operation suits remote sensors, portable medical instruments and wearable electronics where power budgets are tight. The device integrates core peripherals so firmware can manage analogue and digital tasks without external support chips.

QFN28 package enables dense, automated assembly

The 28-pin QFN footprint reduces board area and supports high-volume surface-mount production with standard reflow profiles. Exposed thermal pad improves heat dissipation in sealed enclosures while the leadless design simplifies optical inspection. Pin-compatible layout eases migration from earlier PIC16LF variants during PCB revisions.

Replaces larger DIP or SOIC MCUs

Designers moving from through-hole or wide-body packages gain the same instruction set and peripheral mix in a smaller outline. The jump is worthwhile when board real estate, assembly cost or profile height drive the redesign. Projects staying with existing footprints or requiring higher pin counts will not benefit.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $36.99
Typical for this category: the median of 1,027 items is $34.99.

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What package type does the PIC16LF1826-E use and how many pins does it have?

The PIC16LF1826-E uses a QFN28 package, meaning it has 28 pins in a quad flat no-lead surface-mount format.

What PCB footprint and pad layout does the QFN28 package require?

The QFN28 package needs a 28-pad land pattern with a central thermal pad matching the exposed die pad on the underside of the chip.

How is the PIC16LF1826-E soldered and what step is often missed?

It is reflow-soldered as a surface-mount device; the step often missed is soldering the centre thermal pad to the PCB ground plane for reliable electrical and thermal contact.

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