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YINGHUA

YINGHUA PIC24F32KA302-I ML QFN28 semiconductor

SKU CH-QBEF-DNDD6

A 28-pin QFN microcontroller with 32 KB flash for embedded control applications

  • Product typeICs Semicoductors
  • 32 KB program memory for application code
  • 28-pin QFN package for compact PCB layout
  • New condition ensures reliable long-term operation
  • Microcontroller core for integrated embedded control
  • 24-series architecture for scalable performance

Semiconductor component for embedded design

The YINGHUA PIC24F32KA302-I ML QFN28 is an integrated circuit supplied as new stock. It is intended for engineers and procurement specialists sourcing this specific part number for board-level assembly or repair work.

Suits exact part-number matches.

This component fits builds that call for the PIC24F32KA302-I in a 28-pin QFN package. Buyers who need a different pin count, a different package style, or a different device family should look at other listings.

28-pin QFN package defines board compatibility

The 28-pin QFN footprint is the critical specification that determines whether this device fits the target PCB layout. Verify the land pattern and pin-out against your schematic before ordering.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $35.99
Typical for this category: the median of 1,027 items is $34.99.

Specifications

Product
Product typeICs Semicoductors

Questions about this item

How does the 32 KB flash size affect code storage in a finished design?

The 32 KB flash provides on-chip program memory for firmware, reducing the need for external storage in space-constrained applications.

What does the 28-pin QFN package imply for PCB layout?

The 28-pin QFN footprint requires a compact land pattern with an exposed thermal pad, suited for dense board designs.

What physical space does the QFN28 package need on the board?

The QFN28 package occupies a small surface-mount footprint with 28 perimeter leads and a central pad for soldering and heat dissipation.

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