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Small black QFN64 integrated circuit chip with metal pads

YINGHUA

YINGHUA SEC1300-JZX QFN64 semiconductor

SKU CH-RK9B-1SWJP

A QFN64 packaged semiconductor component for integrated circuit applications

  • Product typeICs Semicoductors
  • SEC1300-JZX QFN64 model identifier simplifies sourcing
  • QFN64 package with 64 pins enables dense PCB layouts
  • IC semiconductor type supports integrated circuit designs
  • New condition ensures factory-fresh reliability for builds
  • First listed by manufacturer in February 2025

Component identity

The YINGHUA SEC1300-JZX is a new integrated circuit supplied in a 64-pin QFN package. It is intended for engineers and procurement specialists who need this specific part number for board-level assembly or repair work.

Practical limits

The QFN64 footprint dictates the PCB land pattern and reflow profile that must be followed during soldering. Electrical characteristics such as voltage rails, timing parameters and thermal limits are defined in the manufacturer datasheet and govern how the device can be used in a circuit.

Upgrade context

This component replaces an existing SEC1300-JZX that has failed or reaches end-of-life on a production line. The jump is justified when the bill of materials calls for this exact part number and no drop-in alternative with identical pinout and specifications has been qualified.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $20.99
Cheaper than about 70% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What does the 64 in QFN64 tell me about this IC?

It indicates a 64-pin quad-flat no-lead package, giving a compact footprint for dense board layouts.

How does the SEC1300 part number help me identify the device in a real design?

SEC1300 is the manufacturer's model code; cross-reference it with the datasheet to confirm electrical parameters and pin-out.

What does the QFN package imply for soldering and thermal performance?

QFN has exposed pads on the bottom, so reflow soldering and good PCB thermal vias are needed for reliable joints and heat transfer.

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