YINGHUA SI53156-A01AGM clock buffer QFN-32 semiconductor
SI53156-A01AGM clock buffer in QFN-32 package for precise timing distribution
- Product typeICs Semicoductors
- Clock buffer IC ensures precise timing distribution
- QFN-32 package enables compact PCB integration
- 32 pins provide extensive connectivity options
- New condition guarantees factory-fresh reliability
- First listed February 21, 2025 for current availability
Clock buffer IC in QFN-32 package
The YINGHUA SI53156-A01AGM is a semiconductor clock buffer supplied in a QFN-32 package. It functions as an integrated circuit for distributing timing signals in electronic designs. The component is offered in new condition and was first listed by the manufacturer in 2025.
Engineers building timing distribution circuits
This device suits engineers who need a clock buffer in a 32-pin QFN footprint for signal distribution tasks. It is not intended for buyers who require a different pin count or package style, nor for designs that call for a clock generator or jitter attenuator instead of a buffer.
32-pin QFN footprint
The defining specification is the QFN-32 package, which dictates PCB layout and soldering requirements. Verifying this footprint against the board design confirms whether the part fits the intended application.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $19.99
- Cheaper than about 72% of the 1,027 comparable items (median $34.99).
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
Does the SI53156-A01AGM clock buffer ship as a single IC or in a tray of multiple units?
The SI53156-A01AGM clock buffer is supplied as an individual IC in a QFN-32 package; any additional passive components or programming tools must be sourced separately.
Is the SI53156-A01AGM offered in alternative packages or pin counts?
The listing specifies only the QFN-32 version of the SI53156-A01AGM; no other package or pin-count options are shown for this part.
How does the QFN-32 footprint of the SI53156-A01AGM affect PCB layout?
The 32-lead QFN package requires a compact PCB footprint with a thermal pad; design the land pattern and solder stencil to match the 32 pins and exposed pad for reliable assembly.
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