YINGHUA TC1189QECTTR SOT235 semiconductor
A SOT-235 packaged IC semiconductor for electronic circuits, newly listed in 2025
- Product typeICs Semicoductors
- TC1189QECTTR SOT235 IC semiconductor for compact circuit designs
- New condition ensures reliable performance from first installation
- SOT235 surface-mount package supports high-density PCB layouts
- Manufacturer listed February 21, 2025 for current production availability
- YINGHUA branded component delivers consistent semiconductor functionality
Component Identity
YINGHUA TC1189QECTTR SOT235 is a new semiconductor device supplied as an IC component. It carries the manufacturer part number TC1189QECTTR and uses a SOT235 package outline. The part was first listed by the manufacturer in February 2025.
Application Fit
This item suits engineers and procurement specialists sourcing a specific SOT235-packaged IC for board-level assembly or repair. It is not for buyers who need a different package style, a different pin count, or a fully tested module with documented electrical parameters.
Deciding Specification
The SOT235 package designation is the single specification that determines whether this part matches the PCB footprint and assembly process. Verify the package code against your bill of materials before ordering.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $8.99
- Cheaper than about 97% of the 1,027 comparable items (median $34.99).
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
What PCB land pattern does the SOT235 package require?
The SOT235 package uses a standard five-pin SOT-23 footprint; match the pad layout to the manufacturer's datasheet for exact dimensions.
How is the TC1189QECTTR oriented during reflow soldering?
Align the pin-one marker on the package with the corresponding mark on the PCB silkscreen before placing the component for reflow.
When should the TC1189QECTTR be replaced in a production design?
Replace the device if electrical testing shows parameter drift beyond the datasheet limits or after a board-level failure analysis identifies it as the root cause.
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