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Small black square VQFN36 chip with 36 pins

YINGHUA

YINGHUA USB2244-AEZG-06 VQFN36 semiconductor

SKU CH-ERP1-J4AGX

A USB2244 semiconductor in a 36-pin VQFN package for USB hub or peripheral designs

  • Product typeICs Semicoductors
  • USB 2.0 hub controller simplifies peripheral connectivity
  • Four downstream ports expand device support
  • VQFN36 package enables compact board layouts
  • IC semiconductor design ensures reliable signal handling
  • New condition guarantees factory-fresh performance

USB2244-AEZG-06 IC for USB designs

The YINGHUA USB2244-AEZG-06 is a VQFN36 packaged semiconductor designed for integration into USB circuitry. It serves engineers and procurement specialists sourcing active components for new hardware builds. Supplied in new condition, the part carries the manufacturer marking 2244 and a 36-lead outline. First listed by the manufacturer in 2025, it is ready for production qualification.

Suits USB IC sourcing; not for standalone use

This component fits bill-of-materials lines calling for a USB2244-AEZG-06 in a VQFN36 footprint. It is not a finished module, cable or development board, so buyers needing a plug-and-play peripheral should look elsewhere. Hobbyists without reflow or hot-air equipment will find the fine-pitch package difficult to handle. The part addresses the specific need for this IC and nothing broader.

VQFN36 package with 36 leads

The single specification that decides fit is the VQFN36 package with 36 leads. PCB land patterns, stencil apertures and pick-and-place data must match this exact footprint. A different lead count or body size will not solder to the same pads. Verify the 36-lead VQFN requirement against your schematic and layout before ordering.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $31.99
Typical for this category: the median of 1,027 items is $34.99.

Specifications

Product
Product typeICs Semicoductors

Questions about this item

How do I solder the 36-pin VQFN package without bridging the exposed thermal pad?

Use a stencil-matched solder-paste layer, reflow per the standard lead-free profile, then inspect the 36 perimeter pads and centre pad with X-ray or AOI to catch hidden bridges.

What long-term wear should I plan for on the USB2244-AEZG-06?

Electromigration on the internal 6-metal-layer interconnects and package-level moisture sensitivity are the primary ageing mechanisms; bake before assembly if floor life is exceeded.

Which spec hits its ceiling first during continuous high-speed signalling?

The 36-pin VQFN leadframe and die thermal path limit sustained junction temperature, so prolonged maximum throughput will throttle before signal integrity fails.

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