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Small black square QFN64 integrated circuit chip

YINGHUA

YINGHUA USB5534BJZX2 QFN64 semiconductor

SKU CH-20JR-A5Y35

A USB semiconductor IC in a 64-pin QFN package, first listed by the manufacturer in February 2025

  • Product typeICs Semicoductors
  • USB controller in compact 64-pin QFN package
  • New semiconductor component for USB interface designs
  • IC semiconductor type supports integrated circuit applications
  • Manufacturer part number 5534 identifies this specific model
  • First listed by manufacturer in February 2025

USB5534BJZX2 QFN64 IC for USB designs

The YINGHUA USB5534BJZX2 is a new semiconductor component supplied in a QFN64 package. It is intended for engineers and procurement specialists who are building or repairing USB-based hardware and need this specific part number.

QFN64 package with 64 pins

The single specification that determines fit is the 64-pin QFN footprint. The board layout must match this exact pin count and pitch; a different package or pin count will not solder to the same pads.

Surface-mount installation requires reflow

Installation uses standard surface-mount reflow soldering for the 64-lead QFN. The exposed thermal pad on the underside must be properly stencilled and soldered; insufficient paste or misalignment typically causes open joints or shorts that prevent the IC from functioning.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $27.99
Cheaper than about 59% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What does the 5534 part number tell me about this IC?

The 5534 designation identifies the specific USB controller die inside the QFN64 package.

What interface standard does this semiconductor support?

The device is a USB controller IC; the exact USB revision is not detailed in the specifications.

What board footprint does the QFN64 package require?

The QFN64 package needs a 64-pad land pattern with a central thermal pad on the PCB.

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