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Small black square VQFN64 IC with 64 pins

YINGHUA

YINGHUA USB5534BJZX3 VQFN64 semiconductor

SKU CH-CBB1-FD0TR

A 64-pin VQFN semiconductor IC for USB applications, first listed February 21, 2025

  • Product typeICs Semicoductors
  • USB interface controller in compact 64-pin VQFN package
  • High-density IC design saves valuable board space
  • New semiconductor component ready for immediate integration
  • Manufacturer part number 5534 identifies exact specification
  • First listed by manufacturer in February 2025

YINGHUA USB5534BJZX3 VQFN64 IC

The YINGHUA USB5534BJZX3 is a semiconductor IC supplied in a VQFN64 package. It is stocked as a new component for electronic assembly or repair work. The part carries the manufacturer reference 5534 and was first listed in 2025.

Engineers and procurement specialists

This component suits engineers and procurement specialists sourcing a USB5534BJZX3 VQFN64 for board-level integration. Buyers who need a different pin count, package style or IC function cannot use this part.

VQFN64 package format

The decisive specification is the VQFN64 package format, which fixes the footprint and pin layout on the PCB. Verify that your board design matches this exact package before ordering.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $31.99
Typical for this category: the median of 1,027 items is $34.99.

Specifications

Product
Product typeICs Semicoductors

Questions about this item

How is the VQFN64 package of the USB5534BJZX3 soldered to the PCB and which step do assemblers most often miss?

The 64-lead VQFN package requires reflow soldering with a thermal pad connection to the board; the step most often missed is applying solder paste to the exposed centre pad so the IC grounds correctly.

What maintenance or replacement will the USB5534BJZX3 need during its service life?

As a solid-state semiconductor with no moving parts, the device itself needs no scheduled maintenance; replacement only occurs if electrical overstress or board-level damage makes the IC non-functional.

What thermal or electrical limit appears first when the USB5534BJZX3 runs continuously at full load?

The junction-temperature ceiling of the silicon die is the first hard limit under sustained maximum current; exceeding it triggers thermal shutdown or permanent damage.

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