YINGHUA USB5744T 2G VQFN56 semiconductor
A USB5744T 2G IC semiconductor in a VQFN56 package, newly listed in February 2025
- Product typeICs Semicoductors
- USB5744T 2G VQFN56 semiconductor for circuit integration
- VQFN56 package enables compact PCB layout
- IC semiconductor type suits electronic component builds
- New condition ensures reliable out-of-box operation
- Manufacturer listing from February 2025 confirms current production
Component identity
The YINGHUA USB5744T 2G VQFN56 is a new semiconductor component classified as an integrated circuit. It is intended for engineers and procurement specialists sourcing this specific part number for board-level designs. Buyers who require a different package style or pin count cannot use this device.
Package and mounting
The part uses a VQFN56 package with 56 pins for surface-mount assembly. This footprint dictates the PCB land pattern and reflow profile required during manufacturing. Automated pick-and-place equipment handles the component, while manual soldering is impractical due to the leadless thermal pad.
Deciding specification
The manufacturer part number USB5744T 2G VQFN56 is the single specification that determines whether this is the correct component. Verify this exact string against your bill of materials before ordering to ensure compatibility with the schematic and layout.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $41.99
- Pricier than about 60% of the 1,027 comparable items (median $34.99).
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
What does the 2G suffix indicate for this USB5744T device?
The 2G marking identifies a specific silicon revision of the USB5744T controller in the VQFN56 package.
How much PCB area does the VQFN56 package need?
The 56-lead VQFN package measures 8 mm by 8 mm and requires a matching land pattern with a central thermal pad.
What is the correct reflow profile for the VQFN56 package?
Follow the manufacturer's lead-free reflow profile; the critical step is ensuring the centre thermal pad solders fully to the PCB ground plane.
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