YINGHUA USB82513AMR VQFN36 semiconductor
A 36-pin VQFN semiconductor IC for USB applications, listed by the manufacturer in 2026
- Product typeICs Semicoductors
- IC semiconductor enables USB connectivity
- VQFN36 package provides 36 pins for integration
- New component ready for immediate assembly
- Part number 82513 identifies the controller variant
- First listed by manufacturer in 2026
USB82513AMR VQFN36 semiconductor
The USB82513AMR is a new semiconductor component supplied by YINGHUA. It is intended for engineers and integrators who need this specific IC for circuit designs or repair work. The part arrives in factory condition ready for assembly.
VQFN36 surface-mount package
The device uses a VQFN36 package with thirty-six contacts on a flat no-lead outline. This footprint requires reflow soldering onto a matching PCB land pattern and suits automated pick-and-place assembly lines. The compact form factor fits dense board layouts where through-hole parts cannot be used.
PCB layout and thermal planning required
Before ordering verify that your board design includes the correct VQFN36 footprint and thermal pad connections. Confirm the supply rails and signal routing match the datasheet electrical specifications. Ensure your assembly process can handle the package profile and reflow temperature profile.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $28.99
- Cheaper than about 58% of the 1,027 comparable items (median $34.99).
Specifications
| Product | |
|---|---|
| Product type | ICs Semicoductors |
Questions about this item
What does the USB82513AMR IC's USB interface standard cap in practice?
The USB82513AMR is a semiconductor IC; its practical throughput is determined by the host controller and PCB layout, not by this component alone.
What PCB footprint and package dimensions does the VQFN36 package require for mounting?
The device uses a VQFN36 package with 36 pins; the PCB must provide a matching 36-lead quad flat no-lead footprint with a thermal pad.
How is the USB82513AMR VQFN36 installed, and what assembly step is most often missed?
It is surface-mounted by reflow soldering; the critical step often missed is soldering the exposed thermal pad to the PCB ground plane for heat dissipation.
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