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YINGHUA

YINGHUA XC3S500E-4FT256I FPGA semiconductor FBGA-256

SKU CH-R7H8-3PK8H

A new field-programmable gate array with 500 K logic cells in a 256-ball FBGA package

  • Product typeICs Semicoductors
  • 500K system gates enable complex logic designs
  • 256-ball FBGA package suits compact board layouts
  • Four speed grade options match timing requirements
  • New condition ensures reliable long-term operation

XC3S500E FPGA for custom logic integration

The XC3S500E-4FT256I is a field-programmable gate array built for engineers who need reconfigurable logic in a compact package. It suits prototyping, signal processing and glue-logic replacement in embedded systems. The 256-ball FBGA footprint fits dense board layouts. Buyers who require on-chip high-speed transceivers or large block-RAM arrays should evaluate larger devices.

Low static power in FBGA-256 package

The Spartan-3E family is designed for low quiescent current, so the device runs cool in typical logic implementations. Dynamic power scales with toggle rate and I/O loading, letting most designs operate without active cooling. The fine-pitch ball grid array provides short thermal paths to the PCB ground planes. Systems with sustained high switching density may need airflow across the package.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $189.99
Pricier than about 85% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

How is the FBGA-256 package soldered onto the board, and what step do builders often miss?

The 256-ball FBGA package requires reflow soldering with a precise thermal profile; the step often missed is applying the correct solder-paste stencil thickness and verifying ball alignment under magnification before reflow.

What maintenance or replacement will the XC3S500E-4FT256I FPGA need during its service life?

The device itself has no moving parts or user-serviceable components; replacement is only needed if the FPGA fails electrically or if a design change requires a different 500-k gate density part.

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