YINGHUA XC6SLX100-3FGG676I FPGA Field Programmable Array FBGA-676 semiconductor
A field-programmable gate array with 100 logic elements in a 676-ball FBGA package for custom digital designs
- Product typeICs Semicoductors
- 100K logic cells enable complex designs
- 676-pin FBGA package supports dense PCB layouts
- 3 speed grade meets high timing demands
- Industrial temperature range suits harsh environments
FPGA with 100 logic units
The YINGHUA XC6SLX100-3FGG676I is a field-programmable gate array supplied in a 676-ball FBGA package. It targets engineers implementing custom digital logic for signal processing, protocol bridging or control functions. The device is new and ready for prototype or production board assembly.
FBGA-676 package integration
The 676-ball grid array requires a matching PCB footprint and controlled-impedance routing for high-speed I/O. Configuration memory and power-regulation circuits must be provided on the host board. The FPGA replaces fixed-function ASICs, freeing the design from mask-set costs and enabling post-deployment logic updates.
How it compares
Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.
- Price $1,510.99
- Pricier than about 93% of the 1,027 comparable items (median $34.99).
Specifications
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Questions about this item
What logic density limits sustained workloads on the XC6SLX100-3FGG676I?
The device provides 100 K logic cells; once a design exceeds this capacity the fabric becomes the first bottleneck under sustained use.
How much heat does the FBGA-676 package dissipate during all-day operation?
The 676-ball FBGA package spreads thermal load across its full ball array, enabling standard board-level cooling for continuous operation.
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