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Small square FBGA-676 FPGA chip with grid of solder balls on matte green substrate

YINGHUA

YINGHUA XC6SLX150-2FGG676C FPGA Field Programmable Array FBGA-676 semiconductor

SKU CH-1FPY-DBG0Y

A 150 K logic-cell FPGA in a 676-ball FBGA package for reconfigurable digital designs

  • Product typeICs Semicoductors
  • 150K logic cells enable complex designs
  • 676-ball FBGA package fits dense boards
  • 2 speed grade meets timing closure
  • Field-programmable architecture supports rapid iteration

YINGHUA XC6SLX150-2FGG676C FPGA

The YINGHUA XC6SLX150-2FGG676C is a field-programmable gate array supplied in a 676-ball FBGA package. It provides 150 logic cells for custom digital circuit implementation. Engineers use this device for prototyping, signal processing, and flexible hardware acceleration tasks.

Developers needing reconfigurable logic

This part suits developers who need reconfigurable logic in a 676-ball FBGA footprint. It is not for buyers who require a different logic capacity or a different package style. Designers needing hard IP blocks not present in this device should evaluate alternative FPGA families.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $168.99
Pricier than about 84% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

How do I solder the FBGA-676 package of the XC6SLX150-2FGG676C onto a PCB, and what step is most often missed?

Use a reflow oven with a lead-free profile matching the 676-ball footprint; the step most often missed is verifying ball alignment under magnification before reflow, as misaligned balls cause shorts on the dense grid.

What maintenance or replacement will the XC6SLX150-2FGG676C need after extended operation?

The FPGA itself has no moving parts or consumables; long-term care focuses on keeping the PCB clean, ensuring stable power rails for the 150K logic cells, and monitoring thermal stress on the FBGA-676 solder joints.

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